Schematic of an optical frequency mixer based on difference-frequency-generation
Measured conversion efficiency tuning curve for two conversion processes, TE conversion to TM and TM conversion to TE.
wavelength conversion mapping from one frequency (w1) to the other (w1’) and multichannel conversion mapping from two input channels (w1 and w2) to two output channels (w1’ and w2’)
Simultaneous wavelength conversion of eight input wavelengths(1546, 1548, 1550, 1552, 1554, 1556, 1558, 1560 nm) to a set of eight converted wavelengths (1538, 1536, 1534, 1532, 1530, 1528, 1526, 1524 nm).measured (a) without a cross polarizer
Simultaneous wavelength conversion of eight input wavelengths(1546, 1548, 1550, 1552, 1554, 1556, 1558, 1560 nm) to a set of eight converted wavelengths (1538, 1536, 1534, 1532, 1530, 1528, 1526, 1524 nm).measured (a) without a cross polarizer, and (b) with a cross-polarizer showing filtering of input wavelengths but allowing collection of converted wavelengths.
Schematic of (a) an optical frequency mixer based on difference-frequency-generation and (b) wavelength conversion mapping from one frequency (w1) to the other (w1’) and multichannel conversion mapping from two input channels (w1 and w2) to two output channels (w1’ and w2’)
Schematic of a quasi-phasematched waveguide wavelength converter with N input wavelengths. Active gain section can be integrated in this waveguide to provide high intensity pump within the waveguide.
Experimentally measured spectrum for simultaneous conversion of two input channels at 1528 nm and 1536 nm and converted waves at 1548 nm and 1556 nm
An illustration of fabrication procedure for a waveguide with patterned crystal orientation. (a) two wafers just before the wafer bonding process, (b) after the bonding, a grating is lithographically patterned, GaAs and InGaP layers are selectively etched to reveal a GaAs surface from the bottom substrate. (c) subsequent growth of a superlattice layer for planarization and a waveguide consisting of a lower Al0.6Ga0.4As cladding layer, an Al0.5Ga0.5As core layer, and an Al0.6Ga0.4As layer completes the growth. The layer thicknesses shown in the figure are for the design utilized for telecommunications wavelength converters at 1.5 microns, and the layers will be thicker for mid-infrared applications. Shown in (d) is a SEM photograph of a fabricated waveguide crossection stained to enhance contrast of the domain boundaries.