3D Electronic-Photonic Integrated Circuits for Future AI and Neuromorphic Computing (3D-EPIC-FAINCING)

Distinguished Professor S. J. Ben Yoo (Electrical and Computer Engineering) wins a new project from iARPA to pursue silicon electronic photonic integrated circuits in three dimensions (3D-EPIC) to create a new generation of systems-on-chip for future artificial intelligence and neuromorphic computing (FAINCING) with ~100× higher throughput and ~100× higher energy-efficiency compared to the state of the art. 

The newly proposed 3D EPIC also supports fundamentally different computing architectures for AI and neuromorphic computing.  (a) Optoelectronic neuromorphic computing, (b) optically reconfigurable computing, and (c) a new generation of computing-in-memory architectures.  

This new project has launched on September 24, with successful progress leading to $2.4M payments two phases.